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Te paninga CVD Silicon Carbide (SiC).

Te paninga CVD Silicon Carbide (SiC).

Kaainga> Hua- TJNE > Whakakikorua CVD > Te paninga CVD Silicon Carbide (SiC).

Paepae Karāpiti Paninga Silicon Carbide
SiC Coated Graphite Tray
Paepae Karāpiti Paninga Silicon Carbide
SiC Coated Graphite Tray

Paepae Karāpiti Paninga Silicon Carbide


Semixlab Technology SiC Coated Graphite Tray is a high-performance process component that combines the mechanical strength of high-density isostatic graphite with the superior chemical resistance of a dense CVD silicon carbide coating. Designed for use in SiC and Si epitaxial reactors, MOCVD systems, diffusion furnaces, oxidation, annealing, and rapid thermal processing (RTP) tools. it's engineered for advanced semiconductor manufacturing. Feel free to contact us.

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Semixlab Special Graphite Raw Materials for Silicon Carbide Coating Graphite Tray

At Semixlab Technology, our Silicon Carbide (SiC) Coated Graphite Trays are engineered to perform reliably in the most demanding semiconductor process environments—where extreme temperatures, corrosive gases, and ultra-clean conditions converge. These trays combine the thermal and mechanical advantages of high-density isostatic graphite with the exceptional chemical stability and surface integrity of a dense CVD silicon carbide coating. The result is a robust, high-purity component that plays an essential role in maintaining process uniformity, yield consistency, and tool uptime across a variety of front-end wafer fabrication steps.

Within epitaxial growth systems—including silicon (Si) and silicon carbide (SiC) epitaxy—the SiC coated graphite tray functions as a precision wafer carrier or susceptor base. It provides stable mechanical support while maintaining uniform temperature distribution across the wafer surface, which is critical for film thickness control, dopant uniformity, and crystal quality. The SiC coating acts as a chemically inert barrier that isolates the graphite substrate from reactive gases such as H₂, HCl, and SiHCl₃, preventing carbon contamination or gas-phase reactions. Its mirror-smooth surface minimizes particle generation and enables long-term operation in high temperature environments up to 1650 °C without degradation.

SiC Coated Set Disc Application Scenarios

Silicon Carbide Coating Graphite Tray Application Scenarios

In MOCVD and compound semiconductor deposition processes—used for GaN, GaAs, and InP device fabrication—the tray serves as a high-temperature wafer carrier that must withstand repeated exposure to hydrogen and ammonia-based chemistries. The superior corrosion resistance of the SiC coating prevents erosion and surface roughening, ensuring consistent film morphology and extended component life. This stability translates directly into more predictable growth conditions and higher equipment throughput for LED, power, and RF device production.

The SiC coated graphite tray also plays a crucial role in diffusion, oxidation, annealing, and rapid thermal processing (RTP) environments. During these high-temperature steps, the tray acts as a support platform that maintains wafer alignment, resists oxidation, and minimizes thermal distortion. Its high thermal conductivity allows for rapid and uniform heat transfer, enabling precise temperature control and reducing thermal stress on the wafers. The SiC barrier further protects against outgassing and metal contamination—two primary causes of yield loss in advanced device manufacturing.

Across all these applications, the Semixlab SiC Coated Graphite Tray functions not merely as a mechanical fixture but as a precision-engineered process interface that defines the thermal, chemical, and cleanliness stability of the entire manufacturing step. By combining advanced CVD coating technology, high-purity material selection, and tight geometric control, Semixlab provides components that meet the stringent reliability and cleanliness standards of modern semiconductor fabs. Each tray is designed for reproducible performance over multiple process cycles, delivering the consistency and durability required by global manufacturers pursuing higher device yield, lower defect density, and extended equipment uptime.

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